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Altium Designer 20 （中文版）高速PCB设计实战攻略

作译者：林超文等

出版时间：2020-03 千字数：582 版次：01-01 页数：364

开本：16开装帧： I S B N ：9787121377815

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纸质书定价：￥89.0

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目  录 
第 1 章 Altium Designer 20 全新功能及性能改进·····················································（1）
 1.1 Altium Designer 20 全新功能概述·············································································（1）
 1.2 主题的切换·········································································································（1） 1.3 ActiveRoute 的重大改进·························································································（3） 1.3.1 扩展的 PCB ActiveRoute 面板 ········································································（3） 1.3.2 Route Guide 中的线到线间距 ·········································································（3） 1.3.3 Meander 控制·····························································································（4）
 1.3.4 长度调整 ··································································································（4） 
1.3.5 支持引脚交换 ····························································································（4） 
1.3.6 其他改进 ··································································································（4） 
1.4 焊盘或过孔连接方式的单独设置··············································································（5） 1.5 布线的改进·········································································································（6） 1.5.1 主动防止出现锐角及避免环路 ·······································································（6） 
1.5.2 对差分对的走线优化 ···················································································（6） 
1.5.3 布线跟随模式 ····························································································（7）
1.6 Draftsman 功能的改进 ···························································································（8） 1.7 无限制地增加机械层·····························································································（8） 1.8 微孔的设计·········································································································（9） 1.9 元器件的回溯功能································································································（9） 1.10 多板的 PCB 设计 ······························································································（10） 1.10.1 多板设计 2.0 的特点·················································································（10） 1.10.2 具体操作方法·························································································（10） 
1.11 高级的叠层管理器 ····························································································（11） 1.12 本章小结 ········································································································（12） 第 2 章 Altium Designer 20 软件概述及安装 ··························································（13） 
2.1 Altium Designer 的系统配置要求及安装···································································（13） 2.1.1 系统配置要求 ··························································································（13）
 2.1.2 Altium Designer 20 的安装···········································································（14） 
2.2 Altium Designer 20 的激活 ····················································································（17） 2.3 本章小结··········································································································（18） 第 3 章 Altium Designer 20 系统参数及软件环境设置 ············································（19） 
3.1 常用系统参数设置······························································································（19） 3.1.1 关闭不必要的启动项 ·················································································（19）
 3.1.2 中英文版本切换 ·······················································································（20） 
 3.1.3 高亮模式及交互选择模式设置 ·····································································（20） 
3.1.4 文件关联开关 ··························································································（21） 
3.1.5 软件的升级及插件的安装路径 ·····································································（22）
 3.1.6 自动备份设置 ··························································································（22）
 3.2 PCB 系统参数的设置 ··························································································（22） 3.2.1 “General”选项卡 ·····················································································（23） 
3.2.2 “Display”选项卡······················································································（24） 
3.2.3 “Board Insight Display”选项卡 ····································································（24） 
3.2.4 “Board Insight Modes 选项卡········································································（25） 
3.2.5 “Board Insight Color Overrides”选项卡 ··························································（25） 
3.2.6 “DRC Violations Display”选项卡 ·································································（26）
3.2.7 “Interactive Routing”选项卡········································································（27） 
3.2.8 “True Type Fonts”选项卡···········································································（28） 
3.2.9 “Defaults”选项卡·····················································································（29） 
3.2.10 “Layer Colors”选项卡··············································································（30） 
3.3 系统参数的保存与调用························································································（30） 3.4 本章小结··········································································································（31） 第 4 章 工程文件管理································································································（32） 4.1 工程的组成·······································································································（32） 4.2 完整工程的创建·································································································（32） 4.2.1 新建工程 ································································································（33） 
4.2.2 已存在工程文件的打开与路径查找 ·······························································（34） 
4.2.3 新建或添加原理图元件库 ···········································································（35）
 4.2.4 新建或添加原理图 ····················································································（36） 
4.2.5 新建或添加封装库 ····················································································（36） 
4.2.6 新建或添加 PCB·······················································································（37） 
4.3 本章小结··········································································································（38） 第 5 章 PCB 封装库设计与管理 ·················································································（39） 5.1 PCB 元件封装的组成 ··························································································（39） 5.2 PCB 封装库编辑界面 ··························································································（39） 5.3 2D 标准封装创建 ·······························································································（40） 5.3.1 向导创建法 ·····························································································（41） 
5.3.2 手动创建法 ·····························································································（45） 
5.4 PCB 封装的检查与报告 ·······················································································（49） 5.5 从PCB 文件生成 PCB 库 ·····················································································（50） 5.6 PCB 封装的复制 ································································································（51） 5.7 3D 封装的创建 ··································································································（51） 5.8 集成库·············································································································（53） 5.8.1 集成库的组成及创建 ·················································································（53） 
5.8.2 集成库的分离 ··························································································（55） 
5.8.3 集成库的安装与移除 ·················································································（56）
 5.9 本章小结··········································································································（57） 第 6 章 PCB 用户界面及快捷键运用 ··········································································（58） 6.1 PCB 设计工作界面介绍 ·······················································································（58） 6.1.1 PCB 设计交互界面····················································································（58） 
6.1.2 PCB 对象编辑窗口····················································································（59） 
6.1.3 PCB 设计常用面板····················································································（59）
 6.1.4 PCB 设计工具栏·······················································································（61） 
6.2 常用系统快捷键·································································································（63） 6.3 快捷键的自定义·································································································（64） 6.3.1 Ctrl+左键单击设置法·················································································（64） 
6.3.2 菜单选项设置法 ·······················································································（64） 
6.4 本章小结··········································································································（65） 第 7 章 网表·············································································································（66） 7.1 原理图封装完整性检查························································································（66） 7.1.1 封装的添加、删除与编辑 ···········································································（66） 
7.1.2 库路径的全局指定 ····················································································（67） 
7.2 网表及网表的生成······························································································（69） 7.2.1 网表······································································································（69） 
7.2.2 网表的生成 ·····························································································（70） 
7.3 网表的导入·······································································································（70） 7.4 本章小结··········································································································（71） 第 8 章 PCB 结构处理 ·······························································································（72） 8.1 板框定义··········································································································（72） 8.2 自定义绘制板框·································································································（74） 8.3 定位孔的放置····································································································（75） 8.4 本章小结··········································································································（76） 第 9 章 布局设计·······································································································（77） 9.1 布局的常用基本操作···························································································（77） 9.1.1 全局操作 ································································································（77） 
9.1.2 选择······································································································（82） 
9.1.3 移动······································································································（85） 
9.1.4 对齐······································································································（86） 
9.2 飞线的使用方法和技巧························································································（87） 9.2.1 显示 /隐藏整板飞线····················································································（87） 
9.2.2 显示 /隐藏元件飞线····················································································（87） 
9.2.3 显示 /隐藏网络飞线····················································································（87） 
9.2.4 显示 /隐藏网络类的飞线··············································································（88） 
9.3 选择过滤器·······································································································（89） 9.4 布局的工艺要求·································································································（90） 9.4.1 特殊器件的布局 ·······················································································（90） 
9.4.2 通孔器件的间距要求 ·················································································（90） 
9.4.3 压接器件的工艺要求 ·················································································（91） 
9.4.4 PCB 辅助边与布局····················································································（92） 
9.4.5 辅助边与母板的连接方式：V-CUT 和邮票孔···················································（92） 
9.5 布局的基本顺序·································································································（93） 9.5.1 交互式布局 ·····························································································（93） 
9.5.2 结构件的定位 ··························································································（95） 
9.5.3 整板信号流向规划 ····················································································（98） 
9.5.4 模块化布局 ·····························································································（98） 
9.5.5 主要关键芯片布局规划 ·············································································（100） 
9.6 布局的常规约束原则··························································································（101） 9.6.1 元件排列原则 ·························································································（101） 
9.6.2 按照信号流向布局原则 ·············································································（102）
 9.6.3 抑制EMC 干扰源 ····················································································（102）
 9.6.4 抑制热干扰 ····························································································（102） 
9.7 本章小结·········································································································（102） 第 10 章 高速多层板的叠层阻抗设计········································································（103） 10.1 PCB 板材及参数特性························································································（103） 10.1.1 覆铜板的定义及结构···············································································（103） 10.1.2 铜箔的定义及应用··················································································（103） 10.1.3 PCB 板材分类························································································（105） 10.1.4 半固化片的形成及特性············································································（106） 10.1.5 PCB 基材常见的性能指标·········································································（108） 
10.2 阻抗计算（以一个八层板为例） ·········································································（110） 10.2.1 微带线阻抗计算·····················································································（110） 
10.2.2 带状线阻抗计算·····················································································（112） 
10.2.3 共面波导阻抗计算··················································································（113） 
10.2.4 阻抗计算的几个注意事项·········································································（114） 
10.3 高速多层板的叠层设计思路 ···············································································（115） 10.3.1 合理的层数···························································································（115） 
10.3.2 VCC、GND 作为参考平面，两者的作用与区别·············································（117） 10.3.3 电源层、地层、信号层的相对位置·····························································（118） 
10.3.4 基于SI/PI、EMC、DFM 的叠层原则 ··························································（121） 
10.4 叠层阻抗设计实例讲解 ·····················································································（121） 10.4.1 四层板叠层阻抗设计实例·········································································（123） 10.4.2 六层板叠层阻抗设计实例·········································································（124） 
10.4.3 假八层及如何避免假八层设计···································································（127） 10.4.4 八层板叠层阻抗设计实例·········································································（129） 
10.5 Altium Designer 20 的叠层管理器介绍···································································（133） 10.6 本章小结 ·······································································································（135） 第 11 章 电源及地平面设计······················································································（136） 11.1 电源和地处理的基本原则 ··················································································（137） 11.1.1 载流能力······························································································（137） 
11.1.2 电源通道和滤波·····················································································（138） 
11.1.3 直流压降······························································································（140） 
11.1.4 参考平面······························································································（141） 
11.1.5 其他要求······························································································（142） 
11.2 常规电源的种类及其设计方法 ············································································（143） 11.2.1 电源的种类···························································································（143） 
11.2.2 POE 电源介绍及设计方法·········································································（143） 11.2.3 48V 电源介绍及设计方法·········································································（144） 
11.2.4 开关电源的设计·····················································································（145） 
11.2.5 线性电源的设计·····················································································（147） 
11.3 Altium Designer 20 对电源与地平面的分割·····························································（147） 11.3.1 Altium Designer 20 的铺铜操作 ··································································（149） 11.3.2 Altium Designer 20 内电层的分割实现 ·························································（154） 
11.4 本章小结 ·······································································································（154） 第 12 章 规则设置····································································································（155） 12.1 类与类的创建 ·································································································（155） 12.1.1 类的简介······························································································（155） 12.1.2 网络类的创建························································································（156） 12.1.3 差分类的创建························································································（158） 
12.2 常用PCB 规则设置项目 ····················································································（160） 12.3 电气规则设置 ·································································································（161） 12.3.1 安全间距规则设置··················································································（161） 12.3.2 规则的使能和优先级设置·········································································（165） 12.3.3 短路规则设置························································································（166） 12.3.4 开路规则设置························································································（167） 
12.4 线宽规则设置 ·································································································（167） 12.5 过孔规则设置 ·································································································（170） 12.6 阻焊规则设置 ·································································································（171） 12.7 铜皮规则设置 ·································································································（171） 12.7.1 负片铜皮连接规则设置············································································（171） 12.7.2 通孔焊盘隔离环宽度设置·········································································（173） 12.7.3 正片铜皮连接规划设置············································································（174） 
12.9 DFM 可制造性规则设置····················································································（175） 12.9.1 孔壁与孔壁之间的距离设置······································································（175） 12.9.2 阻焊桥的宽度设置··················································································（175） 12.9.3 丝印与阻焊之间的距离设置······································································（176） 12.9.4 丝印与丝印之间的距离设置······································································（177） 
12.10 区域规则设置································································································（177） 12.11 差分规则设置································································································（180） 12.12 规则的导入与导出··························································································（182） 12.13 本章小结······································································································（183） 第 13 章 布线设计····································································································（184） 13.1 网络及网络类的颜色管理 ··················································································（184） 13.2 层的管理 ·······································································································（186） 13.3 元素的显示与隐藏 ···························································································（187） 13.4 特殊粘贴法的使用 ···························································································（188） 13.5 布线的基本操作 ······························································································（189） 13.5.1 走线打孔与换层·····················································································（189） 13.5.2 布线过程中改变线宽···············································································（190） 13.5.3 走线角度切换························································································（190） 13.5.4 实时跟踪布线长度及布线保护带显示··························································（191） 13.5.5 布线模式选择························································································（192） 13.5.6 总线布线······························································································（193） 
13.6 PCB 布线扇孔·································································································（194） 13.7 添加泪滴 ·······································································································（195） 13.8 蛇形走线 ·······································································································（196） 13.8.1 单端蛇形线···························································································（197） 13.8.2 差分蛇形线···························································································（198） 
13.9 多种拓扑结构的等长处理 ··················································································（199） 13.9.1 点到点绕线···························································································（199） 13.9.2 Fly_by 结构等长处理···············································································（200） 13.9.3 T 形结构等长处理 ··················································································（201） 13.9.4 From-To 等长法 ·····················································································（202） 13.9.5 xSignals 等长法······················································································（203） 13.10 常见器件 Fanout 处理······················································································（205） 13.10.1 SOP/QFP 等密间距器件的 Fanout······························································（206） 13.10.2 分离器件（小电容）的 Fanout ·································································（207） 13.10.3 分离器件（排阻）的 Fanout ····································································（208） 13.10.4 分离器件（BGA 下小电容）的 Fanout ·······················································（209） 13.10.5 分离器件（Bulk 电容）的 Fanout······························································（209） 13.10.6 BGA 的 Fanout ·····················································································（210） 
13.11 常见BGA 布线方法和技巧···············································································（211） 13.11.1 1.0mm pitch BGA 的布线方法和技巧 ·························································（211） 13.11.2 0.8mm pitch BGA 的布线方法和技巧 ·························································（212） 13.11.3 0.65mm pitch BGA 的布线方法和技巧························································（213） 13.11.4 0.5mm pitch BGA 的布线方法和技巧 ·························································（215） 13.11.5 0.4mm pitch BGA 的布线方法和技巧 ·························································（216） 13.12 布线的基本原则及思路····················································································（218） 13.12.1 布线的基本原则 ···················································································（218） 13.12.2 布线的基本顺序 ···················································································（218） 13.12.3 布线层面规划 ······················································································（219） 13.12.4 布线的基本思路 ···················································································（219）
 13.13 本章小结······································································································（220） 第 14 章 PCB 设计后处理 ························································································（221） 14.1 调整丝印位号 ·································································································（221） 14.1.1 丝印位号调整的原则及常规推荐尺寸··························································（221） 14.1.2 丝印位号的调整方法···············································································（222） 
14.2 距离测量 ·······································································································（223） 14.2.1 点到点距离的测量··················································································（223） 14.2.2 边缘间距的测量·····················································································（224） 
14.3 尺寸标注 ·······································································································（226） 14.3.1 线性标注······························································································（226） 14.3.2 圆弧半径标注························································································（227） 
14.4 输出光绘前需要检查的项目和流程 ······································································（228） 14.4.1 基于Check List 的检查 ············································································（228） 14.4.2 DRC 设置·····························································································（228） 14.4.3 电气性能检查设置··················································································（229） 14.4.4 布线检查设置························································································（230） 14.4.5 Stub 线头检查设置··················································································（231） 14.4.6 丝印上阻焊检查设置···············································································（231） 14.4.7 丝印与丝印交叉或重叠检查······································································（232） 14.4.8 元件高度检查设置··················································································（232） 14.4.9 元件间距检查设置··················································································（232） 
14.5 PCB 生产工艺技术文件说明···············································································（233） 14.6 本章小结 ·······································································································（235） 第 15 章 生产文件输出·····························································································（236） 15.1 装配图 PDF 文件的输出 ····················································································（236） 15.2 生产文件的输出 ······························································································（240） 15.2.1 Gerber 文件的输出··················································································（240） 15.2.2 钻孔文件的输出·····················································································（243） 
15.2.3 IPC 网表的输出······················································································（243） 15.2.4 贴片坐标文件的输出···············································································（243） 
15.3 本章小结 ·······································································································（245） 第 16 章 光绘文件检查及 CAM350 常用操作···························································（246） 
16.1 光绘文件的导入 ······························································································（246） 16.2 光绘层的排序 ·································································································（247） 16.3 各层电气属性的指定 ························································································（248） 16.4 IPC 网表对比，开短路检查················································································（249） 16.5 钻孔文件检查 ·································································································（251） 16.6 最小线宽检查 ·································································································（252） 16.7 最小线距检查 ·································································································（253） 16.8 综合DRC 检查································································································（253） 16.9 阻焊到线的检查 ······························································································（254） 16.10 阻焊到丝印的检查··························································································（255） 16.11 阻焊桥的检查································································································（255） 16.12 本章小结······································································································（256） 第 17 章 Altium Designer 20 高级设计技巧及其应用 ············································（257） 
17.1 FPGA 引脚的调整····························································································（257） 17.1.1 FPGA 引脚调整的注意事项·······································································（257） 17.1.2 FPGA 引脚的调整技巧·············································································（257） 
17.2 相同模块布局布线的方法 ··················································································（261） 17.3 孤铜移除的方法 ······························································································（263） 17.3.1 正片去孤铜···························································································（263） 17.3.2 负片去孤铜···························································································（264） 
17.4 检查线间距时差分间距报错的处理方法 ································································（266） 17.5 PCB 快速挖槽·································································································（267） 17.5.1 放置钻孔······························································································（267） 17.5.2 放置板框层 Board Cutout··········································································（268） 
17.6 插件的安装方法 ······························································································（268） 17.7 PCB 文件中的 Logo 添加···················································································（269） 17.8 3D 模型的导出································································································（272） 17.8.1 3D STEP 模型的输出···············································································（272） 17.8.2 3D PDF 的输出 ······················································································（273） 
17.9 极坐标的应用 ·································································································（273） 17.10 本章小结······································································································（275） 第 18 章 入门案例：USB HUB·················································································（276） 18.1 基本技能 ·······································································································（276） 18.1.1 USB HUB 原理图设计 ·············································································（276） 18.1.2 USB HUB PCB 设计················································································（276） 
18.2 基本知识 ·······································································································（276） 18.2.1 设置差分网络························································································（276） 18.2.2 设置差分对规则·····················································································（280） 18.2.3 差分对走线···························································································（283） 18.2.4 原理图与 PCB 交互布局···········································································（283） 
18.3 USB 差分线设计原则························································································（284） 18.4 本章小结 ·······································································································（285） 第 19 章 入门案例：开关电源 PCB 设计···································································（286） 19.1 基本技能 ·······································································································（286） 19.1.1 绘制电路原理图·····················································································（286） 19.1.2 工作原理······························································································（286） 19.1.3 PCB 设计······························································································（289） 
19.2 PCB 抗干扰设计······························································································（291） 19.2.1 抑制干扰源···························································································（292） 19.2.2 切断干扰传播路径··················································································（294） 19.2.3 提高敏感器件的抗干扰性能······································································（294） 
19.3 本章小结 ·······································································································（295） 第 20 章 进阶案例：摄像头 PCB 设计 ······································································（296） 20.1 基本技能 ·······································································································（296） 20.1.1 IMX274 原理图设计················································································（296） 20.1.2 IMX274 PCB 设计 ··················································································（296） 
20.2 基本知识 ·······································································································（296） 20.2.1 设置差分网络························································································（296） 20.2.2 设置差分对规则·····················································································（302） 20.2.3 差分对走线···························································································（304） 20.2.4 原理图与 PCB 交互布局···········································································（306） 
20.3 差分线设计原则 ······························································································（307） 20.4 本章小结 ·······································································································（307） 第 21 章 DDR3 内存的相关知识及 PCB 设计方法·····················································（308） 21.1 DDR 内存的基础知识 ·······················································································（308） 21.1.1 存储器简介···························································································（308） 21.1.2 内存相关工作流程与参数介绍···································································（308） 21.1.3 内存容量的计算方法···············································································（312） 21.1.4 DDR、DDR2、DDR3 各项参数介绍及对比 ··················································（312） 
21.2 DDR3 互连通路拓扑·························································································（313） 21.2.1 常见互连通路拓扑结构介绍及其种类··························································（313） 21.2.2 DDR3 T 形及 Fly_by 拓扑之应用分析··························································（315） 21.2.3 Write Leveling 功能与 Fly_by 拓扑······························································（317） 
21.3 DDR3 信号说明及分组······················································································（318） 
21.4 DDR3 四片 Fly_by 结构设计···············································································（320） 21.4.1 布局····································································································（320） 21.4.2 VDD、VREF 和 VTT 等电源处理·······························································（322） 21.4.3 Fly_by 结构的 Fanout 处理········································································（324） 21.4.4 数据线及地址线互连···············································································（325） 
21.5 DDR3 两片 T 形结构设计 ··················································································（325） 21.5.1 两片DDR3 T 形结构布局·········································································（326） 
21.5.2 T 形结构 Fanout 处理···············································································（326） 21.5.3 VTT 上拉端接电子处理 ···········································································（327） 
21.6 数据线及地址线等长处理 ··················································································（328） 21.7 内存PCB 设计要点总结 ····················································································（328） 21.8 本章小结 ·······································································································（329） 第 22 章 DDR4 设计概述及 PCB 设计要点介绍 ························································（330） 22.1 DDR4 信号分组·······························································································（330） 22.2 DDR4 布局要求·······························································································（331） 22.3 DDR4 布线要求·······························································································（332） 22.4 DDR4 走线线宽和线间距···················································································（333） 22.5 DDR4 等长要求·······························································································（333） 22.6 DDR4 电源处理·······························································································（334） 22.7 本章小结 ·······································································································（336） 第 23 章 FPGA 中原理图与 PCB 交互布线设计·························································（337） 23.1 实现交互的准备工作 ························································································（337）  
23.2 如何实现 FPGA 原理图与 PCB 交互设计·······························································（339） 23.2.1 交互设置······························································································（339） 23.2.2 实现交互操作························································································（342） 
23.3 原理图与 PCB 一致 ··························································································（343） 23.4 本章小结 ·······································································································（345）

前    言 
随着EDA技术的不断发展，众多EDA工具厂商所提供的EDA工具的性能也在不断提高。 Altium Designer 是原 Protel 软件开发商 Altium 公司推出的一体化的电子产品开发系统。该系 统通过将原理图设计、电路仿真、PCB 绘制编辑、拓扑逻辑自动布线、信号完整性分析和设 计输出等技术完美融合，为设计者提供了全新的设计解决方案，使设计者可以轻松地进行设 计。熟练使用这一软件必将使电路设计的质量和效率大大提高。 Altium Designer 是一个很好的科研和教学平台，主要有以下原因：第一，通过该设计平 台的学习，初学者可以系统全面地掌握电子线路的设计方法，在他们工作后，很容易学习和 使用其他厂商相关的 EDA 工具，如 Allegro、PADS 等；第二，Altium Designer 工具的人机 交互功能特别强大，初学者在使用 Altium Designer 学习电子线路设计的过程中，当接触到 一些比较抽象的理论知识时，可以很容易通过友好的人机交互界面，将抽象理论学习变得 浅显易懂。 本书是由高校教师与从事 PCB 设计的一线工程师合力编写的基于 Altium Designer 20 的 进阶教材，全面兼容 Altium Designer 18 和 Altium Designer 19。作为一线的教学人员，编者具 有丰富的教学实践经验与教材编写经验，多年的教学工作能够准确地把握学生的学习心理与 实际需求。同时，多年从事 PCB 设计的工程师参与本书的编写工作，能够在编写工作中紧紧 结合具体项目，理论结合实例。在本书中，处处凝结着教育者与工程师的经验与体会，贯穿 着教学思想与工程经验，希望能够给广大读者的学习（尤其是自学）提供一个简捷、有效的 捷径。 本书通过理论与实例结合的方式，深入浅出地介绍其使用方法与技巧。本书在编写过程 中力求精益求精，浅显易懂，工程实用性强，通过实例细致地讲述了具体的应用技巧及操作 方法。本书共分含 23 章。内容主要有：
 第 1 章- Altium Designer 20 全新功能及性能改进
 第 2 章- Altium Designer 20 软件概述及安装
 第 3 章- Altium Designer 20 系统参数及软件环境设置 
第 4 章-工程文件管理 
第 5 章- PCB 封装库设计与管理
 第 6 章- PCB 用户界面及快捷键运用
 第 7 章-网表 
第 8 章-PCB 结构处理
 第 9 章-布局设计
 第 10 章-高速多层板的叠层阻抗设计
 第 11 章-电源及地平面设计 
第 12 章-规则设置 
第 13 章-布线设计 
第 14 章- PCB 设计后处理
 第 15 章-生产文件输出 
第 16 章-光绘文件检查及 CAM350 常用操作 
第 17 章- Altium Designer 高级设计技巧及其应用 
第 18 章-入门案例：USB HUB 
第 19 章-入门案例：开关电源 PCB 设计 
第 20 章-进阶案例：摄像头 PCB 设计 
第 21 章-DDR3 内存的相关知识及 PCB 设计方法 
第 22 章-DDR4 设计概述及 PCB 设计要点介绍 
第 23 章-FPGA 中原理图与 PCB 交互布线设计 
 参加本书编写的有国内顶尖设计公司创始人兼首席技术官林超文教师，南京航空航天大 学企业导师李奇先生、广东省职业技能鉴定指导中心电子 CAD 专家组组长杨亭教授、珠海市 技师学院电子系江智莹老师和深圳市英达维诺电路科技有限公司技术总监罗新林先生，耗时 一年完稿。此外，本书还要特别感谢广东省职业技能鉴定指导中心电子 CAD 专家组在百忙中 为本书审稿，并提出了多条宝贵建议。 由于本书涉及的知识面很新，时间又仓促，尽管编者在编写本书的过程中竭尽全力，但 是，由于水平有限，书中难免存在疏漏和不足之处，恳请各位专家和读者提出宝贵建议，可 以发邮件到 26005192@qq.com 与作者进行交流。此外，本书还提供技术支持 QQ 群： 345377375。本书相关配套免费视频已上传至 EDA 无忧学院（www.580eda.net），部分高级案 例由于内容较大，且视频录制工作量巨大，因此采用了增值付费的方式，进阶这部分的读者 可以自行选择。有需要的读者可自行登录观看学习，接受广大读者批评指正。 
 
林超文         2019 年 10 月 10 日于深圳

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